Altium

Design Rule Verification Report

Date: 27/02/2025
Time: 16:15:31
Elapsed Time: 00:00:00
Filename: C:\Users\SimonMartin\Desktop\carte alim\PCB1.PcbDoc
Warnings: 0
Rule Violations: 74

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=20mil) (All),(All) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Modified Polygon (Allow modified: No), (Allow shelved: No) 0
Width Constraint (Min=40mil) (Max=50mil) (Preferred=40mil) (All) 0
Routing Topology Rule(Topology=Shortest) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (Conductor Width=10mil) (Air Gap=10mil) (Entries=4) (All) 0
Hole Size Constraint (Min=1mil) (Max=100mil) (All) 0
Hole To Hole Clearance (Gap=10mil) (All),(All) 48
Minimum Solder Mask Sliver (Gap=10mil) (All),(All) 0
Silk To Solder Mask (Clearance=10mil) (IsPad),(All) 25
Silk to Silk (Clearance=10mil) (All),(All) 1
Net Antennae (Tolerance=0mil) (All) 0
Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All) 0
Total 74

Hole To Hole Clearance (Gap=10mil) (All),(All)
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C10-2(3750mil,2062.795mil) on Multi-Layer And Pad Free-60(3750mil,2062.795mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C11-2(2725mil,1625mil) on Multi-Layer And Pad Free-63(2725mil,1625mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C1-2(5256.102mil,3450mil) on Multi-Layer And Pad Free-50(5256.102mil,3450mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C12-1(3125mil,1500mil) on Multi-Layer And Pad Free-31(3125mil,1500mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C12-2(3262.795mil,1500mil) on Multi-Layer And Pad Free-25(3262.795mil,1500mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C2-2(5412.205mil,3000mil) on Multi-Layer And Pad Free-64(5412.205mil,3000mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C3-1(4500mil,2756.102mil) on Multi-Layer And Pad Free-44(4500mil,2756.102mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C3-2(4500mil,2893.898mil) on Multi-Layer And Pad Free-43(4500mil,2893.898mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C4-2(1450mil,2793.898mil) on Multi-Layer And Pad Free-10(1450mil,2800mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C5-2(1850mil,2793.898mil) on Multi-Layer And Pad Free-9(1850mil,2793.898mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C6-2(2625mil,2550mil) on Multi-Layer And Pad Free-17(2625mil,2550mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C8-2(4250mil,1912.795mil) on Multi-Layer And Pad Free-28(4250mil,1912.795mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad C9-2(4625mil,1918.898mil) on Multi-Layer And Pad Free-32(4625mil,1918.898mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-11(2475mil,3025mil) on Multi-Layer And Pad U1-3(2475mil,3025mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-12(2375mil,3025mil) on Multi-Layer And Pad U1-2(2375mil,3025mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-13(2375mil,2800mil) on Multi-Layer And Pad R3-2(2375mil,2796.85mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-14(2150mil,2800mil) on Multi-Layer And Pad R8-2(2150mil,2800mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-15(2150mil,2400mil) on Multi-Layer And Pad R8-1(2150mil,2406.299mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-16(2375mil,2403.15mil) on Multi-Layer And Pad R3-1(2375mil,2403.15mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-18(2728.15mil,3025mil) on Multi-Layer And Pad R4-2(2728.15mil,3025mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-2(1453.15mil,3050mil) on Multi-Layer And Pad Free-66(1453.15mil,3050mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-2(1453.15mil,3050mil) on Multi-Layer And Pad R1-1(1453.15mil,3050mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-20(3305.881mil,2975mil) on Multi-Layer And Pad R2-2(3303.15mil,2975mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-3(1846.85mil,3050mil) on Multi-Layer And Pad Free-67(1846.85mil,3050mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-3(1846.85mil,3050mil) on Multi-Layer And Pad R1-2(1846.85mil,3050mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-34(4700mil,2525mil) on Multi-Layer And Pad Free-56(4700mil,2525mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-34(4700mil,2525mil) on Multi-Layer And Pad R10-2(4696.85mil,2525mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-41(3828.15mil,2975mil) on Multi-Layer And Pad R6-2(3828.15mil,2975mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-46(4825mil,2975mil) on Multi-Layer And Pad R9-2(4825mil,2971.85mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-47(4825mil,2575mil) on Multi-Layer And Pad Free-55(4825mil,2575mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-47(4825mil,2575mil) on Multi-Layer And Pad R9-1(4825mil,2578.15mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-48(4950mil,2575mil) on Multi-Layer And Pad R7-2(4950mil,2578.15mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-49(4950mil,2971.85mil) on Multi-Layer And Pad R7-1(4950mil,2971.85mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-53(4696.85mil,3125mil) on Multi-Layer And Pad R5-1(4696.85mil,3125mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-54(4303.15mil,3125mil) on Multi-Layer And Pad R5-2(4303.15mil,3125mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-55(4825mil,2575mil) on Multi-Layer And Pad R9-1(4825mil,2578.15mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-56(4700mil,2525mil) on Multi-Layer And Pad R10-2(4696.85mil,2525mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-57(4302.958mil,2527.958mil) on Multi-Layer And Pad R10-1(4303.15mil,2525mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-58(4200mil,2225mil) on Multi-Layer And Pad R13-2(4196.85mil,2225mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-59(3803.15mil,2225mil) on Multi-Layer And Pad R13-1(3803.15mil,2225mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-6(1550mil,3425mil) on Multi-Layer And Pad Q1-3(1550mil,3425mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-61(3903.15mil,2375mil) on Multi-Layer And Pad R11-2(3903.15mil,2375mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-62(4300mil,2375mil) on Multi-Layer And Pad R11-1(4296.85mil,2375mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-65(3700mil,2971.85mil) on Multi-Layer And Pad R2-1(3696.85mil,2975mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-66(1453.15mil,3050mil) on Multi-Layer And Pad R1-1(1453.15mil,3050mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-67(1846.85mil,3050mil) on Multi-Layer And Pad R1-2(1846.85mil,3050mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-7(1650mil,3425mil) on Multi-Layer And Pad Q1-2(1650mil,3425mil) on Multi-Layer Pad/Via Touching Holes
Hole To Hole Clearance Constraint: (Collision < 10mil) Between Pad Free-8(1750mil,3425mil) on Multi-Layer And Pad Q1-1(1750mil,3425mil) on Multi-Layer Pad/Via Touching Holes
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Silk To Solder Mask (Clearance=10mil) (IsPad),(All)
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-13(2375mil,2800mil) on Multi-Layer And Track (2375mil,2727.953mil)(2375mil,2756.496mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-14(2150mil,2800mil) on Multi-Layer And Track (2150mil,2731.102mil)(2150mil,2759.646mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-16(2375mil,2403.15mil) on Multi-Layer And Track (2375mil,2443.504mil)(2375mil,2472.047mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-18(2728.15mil,3025mil) on Multi-Layer And Track (2768.504mil,3025mil)(2797.047mil,3025mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-2(1453.15mil,3050mil) on Multi-Layer And Track (1493.504mil,3050mil)(1522.047mil,3050mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (3.672mil < 10mil) Between Pad Free-20(3305.881mil,2975mil) on Multi-Layer And Track (3343.504mil,2975mil)(3372.047mil,2975mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [3.672mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-3(1846.85mil,3050mil) on Multi-Layer And Track (1777.953mil,3050mil)(1806.496mil,3050mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-34(4700mil,2525mil) on Multi-Layer And Track (4627.953mil,2525mil)(4656.496mil,2525mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-41(3828.15mil,2975mil) on Multi-Layer And Track (3868.504mil,2975mil)(3897.047mil,2975mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-46(4825mil,2975mil) on Multi-Layer And Track (4825mil,2902.953mil)(4825mil,2931.496mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-47(4825mil,2575mil) on Multi-Layer And Track (4825mil,2618.504mil)(4825mil,2647.047mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-48(4950mil,2575mil) on Multi-Layer And Track (4950mil,2618.504mil)(4950mil,2647.047mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-49(4950mil,2971.85mil) on Multi-Layer And Track (4950mil,2902.953mil)(4950mil,2931.496mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-53(4696.85mil,3125mil) on Multi-Layer And Track (4627.953mil,3125mil)(4656.496mil,3125mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-54(4303.15mil,3125mil) on Multi-Layer And Track (4343.504mil,3125mil)(4372.047mil,3125mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-55(4825mil,2575mil) on Multi-Layer And Track (4825mil,2618.504mil)(4825mil,2647.047mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-56(4700mil,2525mil) on Multi-Layer And Track (4627.953mil,2525mil)(4656.496mil,2525mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (6.71mil < 10mil) Between Pad Free-57(4302.958mil,2527.958mil) on Multi-Layer And Track (4343.504mil,2525mil)(4372.047mil,2525mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.71mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-58(4200mil,2225mil) on Multi-Layer And Track (4127.953mil,2225mil)(4156.496mil,2225mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-59(3803.15mil,2225mil) on Multi-Layer And Track (3843.504mil,2225mil)(3872.047mil,2225mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-61(3903.15mil,2375mil) on Multi-Layer And Track (3943.504mil,2375mil)(3972.047mil,2375mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (9.553mil < 10mil) Between Pad Free-62(4300mil,2375mil) on Multi-Layer And Track (4227.953mil,2375mil)(4256.496mil,2375mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.553mil]
Silk To Solder Mask Clearance Constraint: (9.674mil < 10mil) Between Pad Free-65(3700mil,2971.85mil) on Multi-Layer And Track (3627.953mil,2975mil)(3656.496mil,2975mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [9.673mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-66(1453.15mil,3050mil) on Multi-Layer And Track (1493.504mil,3050mil)(1522.047mil,3050mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
Silk To Solder Mask Clearance Constraint: (6.404mil < 10mil) Between Pad Free-67(1846.85mil,3050mil) on Multi-Layer And Track (1777.953mil,3050mil)(1806.496mil,3050mil) on Top Overlay [Top Overlay] to [Top Solder] clearance [6.404mil]
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Silk to Silk (Clearance=10mil) (All),(All)
Silk To Silk Clearance Constraint: (Collision < 10mil) Between Text "J4" (2903mil,2927mil) on Top Overlay And Track (2797.047mil,2975.787mil)(3052.953mil,2975.787mil) on Top Overlay Silk Text to Silk Clearance [0mil]
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