customizeBoard Information Report
Contents
Contents
Board Specification
General
Routing
Routing Information
Layer Information
Layer Information
Drill Pairs
Copper Area
Copper Area
Board Holes
Non-Plated Hole Size
Plated Hole Size
Board Slots
Non-Plated Slot Size
Plated Slot Size
Board Square Holes
Non-Plated Square Hole Size
Plated Square Hole Size
Other
Top Layer Annular Ring Size
Mid Layer Annular Ring Size
Bottom Layer Annular Ring Size
Pad Solder Mask
Pad Paste Mask
Pad Pwr/Gnd Expansion
Pad Relief Conductor Width
Pad Relief Air Gap
Pad Relief Entries
Via Solder Mask
Track Width
Arc Line Width
Arc Radius
Arc Degrees
Text Height
Text Width
Net Track Width
Net Via Size
Board Specification
General |
Board Size |
100mm
x 100mm
|
Components on board |
6 |
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Routing
Routing Information |
Routing completion |
42.86% |
Connections |
7 |
Connections routed |
3 |
Connections remaining |
4 |
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Layer Information
Layer |
Arcs |
Pads |
Vias |
Tracks |
Texts |
Fills |
Regions |
ComponentBodies |
Top Layer |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Layer |
0 |
0 |
0 |
0 |
0 |
0 |
1 |
0 |
Board |
0 |
0 |
0 |
4 |
0 |
0 |
0 |
0 |
Bottom Component Center |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Route Tool Path |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Dimensions |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top 3D Body |
0 |
0 |
0 |
8 |
0 |
0 |
0 |
6 |
Bottom 3D Body |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Component Center |
0 |
0 |
0 |
4 |
0 |
0 |
0 |
0 |
Top Component Outline |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Component Outline |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Glue Points |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Glue Points |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Coating |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Coating |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Assembly |
0 |
0 |
0 |
8 |
2 |
0 |
0 |
0 |
Bottom Assembly |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Courtyard |
0 |
0 |
0 |
8 |
0 |
0 |
0 |
0 |
Bottom Courtyard |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Designator |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Designator |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Fab Notes |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Assembly Notes |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Multi-Layer |
0 |
16 |
0 |
0 |
0 |
0 |
1 |
0 |
Drill Guide |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Keep-Out Layer |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Drill Drawing |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Paste |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Top Overlay |
2 |
0 |
0 |
48 |
12 |
0 |
0 |
0 |
Top Solder |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Solder |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Overlay |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Bottom Paste |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
0 |
Total |
2 |
16 |
0 |
80 |
14 |
0 |
2 |
6 |
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Copper Area
Layer |
Sq.In. |
Sq.MM. |
Percent of layer |
Top Layer |
0.028 |
17.822 |
0% |
Bottom Layer |
14.855 |
9584.063 |
96% |
Total |
14.883 |
9601.885 |
|
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Board Holes
Non-Plated Hole Size |
Pads |
Vias |
Total |
0 |
0 |
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Plated Hole Size |
Pads |
Vias |
0.7mm
|
8 |
0 |
1.1mm
|
8 |
0 |
Total |
16 |
0 |
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Board Slots
Non-Plated Slot Size / Length |
Pads |
Total |
0 |
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Plated Slot Size / Length |
Pads |
Total |
0 |
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Board Square Holes
Non-Plated Square Hole Size |
Pads |
Total |
0 |
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Plated Square Hole Size |
Pads |
Total |
0 |
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Other
Top Layer Annular Ring Size |
Count |
0.5mm
|
8 |
0.6mm
|
8 |
Total |
16 |
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Mid Layer Annular Ring Size |
Count |
0.5mm
|
8 |
0.6mm
|
8 |
Total |
16 |
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Bottom Layer Annular Ring Size |
Count |
0.5mm
|
8 |
0.6mm
|
8 |
Total |
16 |
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Pad Pwr/Gnd Expansion |
Count |
0.381mm
|
16 |
Total |
16 |
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Pad Relief Conductor Width |
Count |
0.254mm
|
16 |
Total |
16 |
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Pad Relief Air Gap |
Count |
0.254mm
|
16 |
Total |
16 |
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Pad Relief Entries |
Count |
4 |
16 |
Total |
16 |
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Via Solder Mask |
Count |
Total |
0 |
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Arc Line Width |
Count |
0.25mm
|
2 |
Total |
2 |
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Arc Degrees |
Count |
360 |
2 |
Total |
2 |
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Net Track Width |
Count |
0.254mm
|
5 |
Total |
5 |
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Net Via Size |
Count |
0.508mm
|
5 |
Total |
5 |
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