Altiumcustomize

Board Information Report

Date: 04/01/2025
Time: 19:26:34
Elapsed Time: 00:00:00
Filename: C:\Users\asad1\OneDrive\Documents\BUT GEII\S5\SAE_ProjetTutoré\TECHNIQUE\SIGNAL_ANALOGIQUE\ELECTRONICS\SCHEMATICS\Carte_Mere\Carte_Mere\PCB1.PcbDoc
Units:
mmmils

Contents

Contents

Board Specification

General

Routing

Routing Information

Layer Information

Layer Information

Drill Pairs

Copper Area

Copper Area

Board Holes

Non-Plated Hole Size

Plated Hole Size

Board Slots

Non-Plated Slot Size

Plated Slot Size

Board Square Holes

Non-Plated Square Hole Size

Plated Square Hole Size

Other

Top Layer Annular Ring Size

Mid Layer Annular Ring Size

Bottom Layer Annular Ring Size

Pad Solder Mask

Pad Paste Mask

Pad Pwr/Gnd Expansion

Pad Relief Conductor Width

Pad Relief Air Gap

Pad Relief Entries

Via Solder Mask

Track Width

Arc Line Width

Arc Radius

Arc Degrees

Text Height

Text Width

Net Track Width

Net Via Size


Board Specification

General
Board Size 100mm  x  100mm
Components on board 6

Back to top

Routing

Routing Information
Routing completion 42.86%
Connections 7
Connections routed 3
Connections remaining 4

Back to top

Layer Information

Layer Arcs Pads Vias Tracks Texts Fills Regions ComponentBodies
Top Layer 0 0 0 0 0 0 0 0
Bottom Layer 0 0 0 0 0 0 1 0
Board 0 0 0 4 0 0 0 0
Bottom Component Center 0 0 0 0 0 0 0 0
Route Tool Path 0 0 0 0 0 0 0 0
Dimensions 0 0 0 0 0 0 0 0
Top 3D Body 0 0 0 8 0 0 0 6
Bottom 3D Body 0 0 0 0 0 0 0 0
Top Component Center 0 0 0 4 0 0 0 0
Top Component Outline 0 0 0 0 0 0 0 0
Bottom Component Outline 0 0 0 0 0 0 0 0
Top Glue Points 0 0 0 0 0 0 0 0
Bottom Glue Points 0 0 0 0 0 0 0 0
Top Coating 0 0 0 0 0 0 0 0
Bottom Coating 0 0 0 0 0 0 0 0
Top Assembly 0 0 0 8 2 0 0 0
Bottom Assembly 0 0 0 0 0 0 0 0
Top Courtyard 0 0 0 8 0 0 0 0
Bottom Courtyard 0 0 0 0 0 0 0 0
Top Designator 0 0 0 0 0 0 0 0
Bottom Designator 0 0 0 0 0 0 0 0
Fab Notes 0 0 0 0 0 0 0 0
Assembly Notes 0 0 0 0 0 0 0 0
Multi-Layer 0 16 0 0 0 0 1 0
Drill Guide 0 0 0 0 0 0 0 0
Keep-Out Layer 0 0 0 0 0 0 0 0
Drill Drawing 0 0 0 0 0 0 0 0
Top Paste 0 0 0 0 0 0 0 0
Top Overlay 2 0 0 48 12 0 0 0
Top Solder 0 0 0 0 0 0 0 0
Bottom Solder 0 0 0 0 0 0 0 0
Bottom Overlay 0 0 0 0 0 0 0 0
Bottom Paste 0 0 0 0 0 0 0 0
Total 2 16 0 80 14 0 2 6

Back to top

Drill Pairs Vias
Total 0

Back to top

Copper Area

Layer Sq.In. Sq.MM. Percent of layer
Top Layer 0.028 17.822 0%
Bottom Layer 14.855 9584.063 96%
Total 14.883 9601.885

Back to top

Board Holes

Non-Plated Hole Size Pads Vias
Total 0 0

Back to top

Plated Hole Size Pads Vias
0.7mm 8 0
1.1mm 8 0
Total 16 0

Back to top

Board Slots

Non-Plated Slot Size / Length Pads
Total 0

Back to top

Plated Slot Size / Length Pads
Total 0

Back to top

Board Square Holes

Non-Plated Square Hole Size Pads
Total 0

Back to top

Plated Square Hole Size Pads
Total 0

Back to top

Other

Top Layer Annular Ring Size Count
0.5mm 8
0.6mm 8
Total 16

Back to top

Mid Layer Annular Ring Size Count
0.5mm 8
0.6mm 8
Total 16

Back to top

Bottom Layer Annular Ring Size Count
0.5mm 8
0.6mm 8
Total 16

Back to top

Pad Solder Mask Count
0mm 8
0.254mm 8
Total 16

Back to top

Pad Paste Mask Count
0mm 8
0.254mm 8
Total 16

Back to top

Pad Pwr/Gnd Expansion Count
0.381mm 16
Total 16

Back to top

Pad Relief Conductor Width Count
0.254mm 16
Total 16

Back to top

Pad Relief Air Gap Count
0.254mm 16
Total 16

Back to top

Pad Relief Entries Count
4 16
Total 16

Back to top

Via Solder Mask Count
Total 0

Back to top

Track Width Count
0.1mm 36
0.2mm 40
0.254mm 4
Total 80

Back to top

Arc Line Width Count
0.25mm 2
Total 2

Back to top

Arc Radius Count
0.125mm 2
Total 2

Back to top

Arc Degrees Count
360 2
Total 2

Back to top

Text Height Count
1mm 4
1.524mm 10
Total 14

Back to top

Text Width Count
0.1mm 2
0.254mm 12
Total 14

Back to top

Net Track Width Count
0.254mm 5
Total 5

Back to top

Net Via Size Count
0.508mm 5
Total 5

Back to top